Products

SHB150

PICMG 1.3 Full-size CPU Card with LGA1151 8th Gen Intel® Core™ Processor, Intel® C246/Q370/H310, SATA3, USB 3.1 Gen1/Gen2, Dual LANs and DVI-I

Status：Coming Soon

Datasheet (PDF)

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Features

CPU	LGA1151 socket 8th gen Intel® Core™ processor
Chipset	Intel® C246/Q370/H310
System Memory	2 x 288-pin DDR4-2666/2400 un-buffered ECC long-DIMM, up to 32GB (C246) 2 x 288-pin DDR4-2666/2400 un-buffered long-DIMM, up to 32GB (Q370/H310)
BIOS	AMI
COM	2 x RS-232 2 x RS-232/422/485, mode selection by SW
USB	Intel® C246/Q370: 2 x USB 3.1 Gen2, 4 x USB 3.1 Gen1 & 6 x USB 2.0 Intel® H310: 4 x USB 3.1 Gen1 & & 6 x USB 2.0
Ethernet	1 x 10/100/1000 Mbps (Intel® i219-LM) 1 x 10/100/1000 Mbps (Intel® i211-AT)
Display	1 x DVI-I 1 x DisplayPort (header)
Digital I/O	N/A
Audio	MIC-in/Line-in/Line-out/Speaker-out
Storage	Intel® C246/Q370: 6 x SATA-600, support RAID 0/1/5/10 Intel® H310: 4 x SATA-600 M.2 2280 Key M, PCIe x4 signal (Intel® C246/Q370)
Expansion	Edge Connector A: 1 x PCIe x16 Gen3 Edge Connector B: 1 x PCIe x4 or 4 x PCIe x1 Gen3 Edge Connector D: 4 x 32-bit PCI bus masters
Others	1 x PS/2 keyboard internal connector 1 x PS/2 mouse internal connector TPM 2.0 (optional) 1 x LPT 1 x Smart fan for system Fan1/Fan2
Battery	Lithium 3V/220 mAH
Power Requirements	TBC
Watchdog Timer	225 levels, 1 to 255 sec.
Hardware Monitoring	Yes
Operating Temperature	0°C to +60°C (+32°F to +140°F)
Relative Humidity	10% to 95% relative humidity, non-condensing
Dimensions	338 x 126 mm
Board Thickness	1.6 mm
Certifications	CE

SHB150DGG-Q370
PICMG 1.3 full-size CPU card with LGA1151 socket, Intel® Q370, DVI-I, 2 GbE LANs, and PCIe x1
SHB150DGG-Q370
PICMG 1.3 full-size CPU card with LGA1151 socket, Intel® Q370, DVI-I, 2 GbE LANs, and PCIe x4
5938A808010E
2 x USB 2.0 cable with bracket, P=2.54 mm, L=190 mm
5948C122800E
2 x USB 3.1 (Gen1) cable with bracket, L=400 mm
59380000290E
PS/2 keyboard & mouse cable with bracket
593826A0000E
SATA signal cable/red, L=500mm
E393242100
AX93242-RC HD audio converter kit
59380402010E
1 x COM port cable with bracket, P=2.54 mm, L=300 mm
59380703000E
2 x COM port cable with bracket, P=2.54 mm, L=300 mm
594826A0010E
DVI-I to DVI-D+VGA Y cable
83935151000E
TPM 2.0 module (AX93515)

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PICMG 1.3 Full-size CPU Card with LGA1151 7th/6th Gen Intel® Core™, Intel® Q170/H110, SATA3, USB 3.0, LAN and DVI-I

Datasheet (PDF)

CPU	LGA1151 socket 8th gen Intel® Core™ processor
Chipset	Intel® C246/Q370/H310
System Memory	2 x 288-pin DDR4-2666/2400 un-buffered ECC long-DIMM, up to 32GB (C246) 2 x 288-pin DDR4-2666/2400 un-buffered long-DIMM, up to 32GB (Q370/H310)
BIOS	AMI
COM	2 x RS-232 2 x RS-232/422/485, mode selection by SW
USB	Intel® C246/Q370: 2 x USB 3.1 Gen2, 4 x USB 3.1 Gen1 & 6 x USB 2.0 Intel® H310: 4 x USB 3.1 Gen1 & & 6 x USB 2.0
Ethernet	1 x 10/100/1000 Mbps (Intel® i219-LM) 1 x 10/100/1000 Mbps (Intel® i211-AT)
Display	1 x DVI-I 1 x DisplayPort (header)
Digital I/O	N/A
Audio	MIC-in/Line-in/Line-out/Speaker-out
Storage	Intel® C246/Q370: 6 x SATA-600, support RAID 0/1/5/10 Intel® H310: 4 x SATA-600 M.2 2280 Key M, PCIe x4 signal (Intel® C246/Q370)
Expansion	Edge Connector A: 1 x PCIe x16 Gen3 Edge Connector B: 1 x PCIe x4 or 4 x PCIe x1 Gen3 Edge Connector D: 4 x 32-bit PCI bus masters
Others	1 x PS/2 keyboard internal connector 1 x PS/2 mouse internal connector TPM 2.0 (optional) 1 x LPT 1 x Smart fan for system Fan1/Fan2
Battery	Lithium 3V/220 mAH
Power Requirements	TBC
Watchdog Timer	225 levels, 1 to 255 sec.
Hardware Monitoring	Yes
Operating Temperature	0°C to +60°C (+32°F to +140°F)
Relative Humidity	10% to 95% relative humidity, non-condensing
Dimensions	338 x 126 mm
Board Thickness	1.6 mm
Certifications	CE